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Chipset Headlines

BBC Arm Holdings profits up over 40%
Arm Holdings, which designs chips used in iPhones, sees its profits rise after successfully agreeing more deals to licence its designs.

InfoWorld Coming next year: 802.11ac for faster Wi-Fi
Gigabit-speed wireless LAN products based on the emerging IEEE 802.11ac standard will start shipping next year and usher Wi-Fi into its next era of high speed and long range, communications chip maker Broadcom said Thursday.

InfoWorld Broadcom to unveil four chips for faster '5G Wi-Fi'
The International Consumer Electronics Show next week may be a major launchpad for a new, faster generation of Wi-Fi that goes about three times faster than current gear, with at least one major silicon vendor announcing and demonstrating a set of chips for the IEEE 802.11ac standard. Broadcom is announcing the four chips for PCs and consumer electronics products on Thursday, a few days ahead of the massive trade show that formally opens next Tuesday, and said it is already shipping the...

BWE Magazine UltraWideband Rollout Continues Pace by Electing CSR to WiMedia Alliance Board
CSR (LSE: CSR) announced that Kristine Overlaur has been appointed to the board responsible for bringing UWB (Ultra Wideband) Bluetooth to the mass market, the WiMedia Alliance. The appointment underlines CSR's UWB technology for worldwide use in mobile phones and other battery powered portable devices, with single chip silicon available in H208 with volume ramping in 2009.

BWE Magazine Ultrawideband Broadband Wireless Chipset Manufacturer Secures $24 Million in Funding
Wisair, a leading provider of single-chip based Ultra Wideband (UWB) and Wireless USB (WUSB) solutions, announced that it has secured $24 million in its latest round of funding. The financing included four new international investors and was led by Susquehanna Growth Equity (SGE), a US-based private equity fund investing in growth capital and late stage venture opportunities. SGE was joined by European-based Advent Venture Partners, Bridge Capital Fund of Japan (an affiliate of Nikko Antfactory), and Yasud...

BWE Magazine WiMedia Certifies First PHYs for High Band Operation, Paving the Way for Global UWB Adoption
The WiMedia Alliance announced the certification of the first three Ultra Wideband (UWB) physical layer chipsets (PHYs) to support the WiMedia Spectrum Extension Release (SER) announced in August. The chips from Alereon, Realtek and Staccato Communications support operation in Band Groups 1 and 3 (3.1 to 4.8GHz and 6.3 to 7.9GHz, respectively). The Alereon and Staccato chips also support operation in Band Group 6 (7.4 to 9.0GHz).

FreeNewsFeed Smartphone Sales Boost Samsung Profit
Samsung Electronics Co. reported a 17 percent jump in fourth quarter profit on the strength of smartphone sales even as the company battled claims it had copied Apple's iPhone. Samsung said Friday in a regulatory filing that its net profit reached 4 trillion won ($3.5 billion) in the three months that ended in December. The company earned 3.4 trillion won in the same quarter a year earlier. The Suwon, South Korea-based company said its operating profit jumped 75.8 percent to 5.3 trillion won in the fourt...

GPS News tm_news_013012_3
Rohde & Schwarz adds GLONASS and P code for GPS to the GNSS simulator in the R&S®SMBV100A Jan 24, 2012 - The options for GLONASS (R&S®SMBV-K94) and GPS P code (R&S®SMBV-K93) have been launched for GNSS chipset and module manufacturers

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Research Reports

Technologies for Intelligent Transportation Systems
BCC Research, Jan 2010

WTRS Wireless Sensor Network Technology Trends Report Q4 2010; Single Issue
West Technology Research Solutions, LLC, Jan 2010

The WTRS Wireless Sensor Network Technology Trends Q2 2010, One year quarterly subscription
West Technology Research Solutions, LLC, Jan 2010

WTRS Wireless Sensor Network Technology Trends Report Q4 2010; One Year Subscription
West Technology Research Solutions, LLC, Jan 2011

More Research Reports
 

Wireless Development Tools, Software, Hardware

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Featured Research Reports

Advances in WSN and Smart Sensors Developments: Technologies and Markets

This report addresses advances in Wireless Smart Sensors networking. Particular, it concentrates on the following subjects:
  • Specifics of Wireless Smart Sensors technologies
  • Market for networks based on Wireless Smart Sensors
  • Wireless Smart Sensors applications
  • Wireless Smart Sensors networking industry
  • Wireless Smart Sensors standardization process
  • Specifics of technologies and markets for WSN
  • Role of power harvesting in the Wireless Smart Sensors development
  • Role of power harvesting to keep a Green Society
  • Analysis of mesh networking with Wireless Smart Sensors
  • Progress in mesh networking standardization
  • Market for mesh networking products, including Wireless Smart Sensors
  • Mesh networking industry.
The report analyzes Wireless Smart Sensor networking from both positions: manufacturer and end-user. The industry technological and marketing trends and results of vendors' and their portfolios surveys are presented.

Among the most important WSN/SS developments the report emphasizing:
  • Maintenance-free services based on self-powered wireless smart sensors
  • Self-organizing and self-healing WSN based on mesh structures.

Published By: Practel, Inc.
Date Published: Jan 2012

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Worldwide Top 10 Mobile Phone Chipset and Connectivity Semiconductor 3Q11 Vendor Shares

This IDC update provides the top vendor rankings for the worldwide mobile phone chipset, applications processor, and connectivity semiconductor market for the third calendar quarter of 2011. This is a quarterly deliverable that tracks the top mobile phone semiconductor vendors in several key device categories. The accompanying Excel spreadsheet includes the results of this data deliverable and is broken out by:

  • The top 10 worldwide mobile phone semiconductor vendors for 3Q11. Select components include chipsets, discrete applications processors, media coprocessors, and connectivity technologies.
  • The top 10 worldwide mobile phone chipset vendors for 3Q11. Chipsets are defined as air interface-specific components only and include integrated and discrete baseband processors, transceiver and RF components, and power amplifiers.
  • The top 10 worldwide mobile phone connectivity semiconductor vendors for 3Q11.Connectivity chips include WiFi, Bluetooth, broadcast radio, GPS, WiMAX, mobile TV, and NFC.
  • The top 6worldwide smart phone applications processor vendors for 3Q11. Applications processors are broken out as discrete devices and integrated solutions that include baseband processing circuitry also.

A draft of this IDC update and Excel data file were sent via email to clients of IDC's Semiconductors: Wireless and Wired Communications research program on December 9, 2011.

Published By: IDC
Date Published: Nov 2011

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