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Bluetooth Wireless
Technologies
Products, documentation, news...
W7020 Bluetooth Radio Subsystem
W7020 is a complete, low-power Bluetooth radio subsystem in a single
component. As part of Lucent's Bluetooth solution, the W7020 interfaces
directly to the W7400 baseband controller and an antenna. Designed to
operate at a low 2.7V and incorporating low power mode features, the W7020
is engineered for long battery life.
W7020 Bluetooth Radio Module
The radio is based on a BiCMOS RFIC. The RX path is completely
integrated from LNA to sliced RX Data output including integrated IF
bandpass and post-detection filtering. The TX architecture is simple and
uses low bias current. The TX Data is guassian filtered and then directly
injected onto the off-chip VCO tank which drives the power stage for the TX
output. The integer-N synthesizer uses an on-chip 13 MHz reference
oscillator that only needs to have a 13MHz crystal applied external to the
module or can be overdriven by the GSM handset reference clock. The RFIC
provides a buffered reference clock signal for the BB, along with a 1MHz
sync clock to the BB for the TX Data timing. A low-power digital 3.2KHz
slow clock is provided to the BB to keep system time during sleep mode.
The front-end antenna filter, TX/RX switch, baluns and impedance
matching networks are integrated into the LTCC substrate comprising both
embedded passive inductors, capacitors and striplines and other assembled
SMT components. Since LTCC allows for multi-layer stack-ups with multiple
ground planes, the baluns are designed in stripline. This gives much better
tolerance performance than Pseudo-balun L-C, C-L designs, which do both
matching and phase shifting/combining of the differential signal to
single-ended.
The TX output power is 0dBm meeting Bluetooth Class 2 requirements and
can tune over the complete Bluetooth 2.4GHz ISM band of 2.400 to 2.497 GHz.
The RX sensitivity is typically –78dBm for 0.1% BER and meets all
interference and blocking requirements without the need for additional
external filtering.
The module size is 9.7 X 14.0 X 1.6 mm and uses Land Grid Array (LGA)
solder pads. The advantage of LGA over a Ceramic Ball Grid Array (CBGA)
package is that the LGA package can easily shrink in size and not become
pad limited for a given I/O.
W7020 Bluetooth Radio Module Block Diagram
The W7020 is virtually a “shrink wrapped” System-in-a-Package
module. There is no RF-critical design and layout work needed for the host
product. To form a Bluetooth node, simply hook up the antenna, dc power and
BB interface. The module has all of the RF-critical functions and passives
integrated into the LTCC substrate.
This results in a reduced “cost of ownership” for the OEM using the
W7020 Bluetooth radio. Thus the handset maker immediately recognizes the
advantages of this radio solution through easier development and production
including design, PCB layout, testing, certification, inventory and supply
chain management, and end-product yield. As opposed to a standard IC
packaged RF solution, which requires the OEM to handle and assemble many
external SMT passives, packaged active devices and filters as well as take
on additional RF PCB design work, the W7020 single-component Bluetooth
radio module forms a complete radio.
