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Philips
Royal Philips Electronics of the Netherlands is one of the world’s
biggest electronics companies and Europe’s largest, with sales of EUR 32.3
billion in 2001. It is a global leader in color television sets, lighting,
electric shavers, medical diagnostic imaging and patient monitoring, and
one-chip TV products. Its 189,000 employees in more than 60 countries are
active in the areas of lighting, consumer electronics, domestic appliances,
components, semiconductors, and medical systems..
Philips
Philips Semiconductors,
Marketing & Sales Communications
Building HVG
P.O. Box 218
5600 MD EINDHOVEN
The Netherlands
Fax. +31 40 27 24825
Web: www.philips.com
Comments
& Questions
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Sydney:
3 Figtree Drive
Homebush NSW 2140
Australia
Tel:+61 2 9704 8141
Fax:+61 2 9704 8139 |
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Melbourne:
745 Springvale Road,
Mulgrave VIC 3170
Australia
Tel:+61 3 9271 3666
Fax:+ 61 3 9271 3688 |
Bluetooth Products
Bluetooth Headsets
infoSync Philips
unveils new phones, BT headset (2/02)
Philips has unveiled a new Bluetooth headset and three new mobile phone
models in its Fisio series - one of which could give the Ericsson T68 some
serious competition. Three new mobile phones in the Philips Fisio line-up
as well as a new Bluetooth headset have suddenly sprung from the designer
minds with Philips, disproving any claims that Philips would be backing out
of the mobile phone market. The new models range from the state-of-the-art
Fisio 820 sporting Bluetooth, GPRS and a color display, to the Fisio 120
which is more of a basic youth phone.
The Fisio 820 has a volume of only 77 cc and weighs only 85 grams,
including the integrated antenna and comes in a choice of satin-finish
Sahara (light gold), Crystal (light blue) and striking, high-gloss Mars
(red) colors. Sporting a large 256-color display (112 x 112 pixels), which
can show up to 9 lines of text, or 150 characters, the Fisio 820 - like the
Ericsson T68 - allows users to set wallpapers and screen savers of their
own preference. Users can create and modify their own images using the
special ‘image companion’ software that comes with the phone.
Bluetooth - No cables, no limits brochure (PDF)
Philips Semiconductors offers a broad range of Bluetooth solutions, from
turnkey systems to all the ICs required for your own design-ins. First
generation solutions do not include integrated Flash memory or CODECs for
voice transmission.
TrueBlue
RF Modules
TrueBlue RF modules - the fast track with Plug & Play designs
BGB100 compact radio module
- Plug & Play cost/size optimized radio module
- No external RF components needed
- 0 dBm output at antenna
- 120 mm2 small-footprint surface-mount package
- Sensitivity –80 dBm at antenna
- Seamless interface to 2nd generation baseband controllers
- On-board antenna switch, filtering and matching networks
- Handled by standard pick-and-place equipment
BGB100 Datasheet (PDF)
BGB100 Block Diagram
BGB120 long-range radio module
- Plug & Play cost/size optimized radio module
- No external RF components needed
- 20 dBm output at antenna
- 140 mm2 small-footprint surface-mount package
- Target sensitivity: –85 dBm at antenna
- Seamless interface to 2nd generation baseband controllers.
- On-board antenna switch, filtering and matching networks
- Handled by standard pick-and-place equipment
BGB101 low-power radio module optimized for cellular applications
- Plug & Play cost/size optimized radio module
- No external RF components needed
- 0 dBm output at antenna
- 90 mm2 small-footprint surface-mount package
- Sensitivity: -80 dBm at antenna
- Low power consumption: 40 mA @ 3 V in full Rx active mode
- Seamless interface to 2nd generation baseband controllers
- On-board antenna switch, filtering and matching networks
- Increase temperature range -30 to + 80 °C
- Handled by standard pick-and-place equipment
UAA3558 Bluetooth radio IC
- Single-chip, fully integrated low-IF transceiver
- Low phase noise VCO
- Typical sensitivity: -85 dBm
- 4 dBm output preamplifier
- No SAW filter or crystal filters required
- Very low cost radio
- Interface chip (PCF26100) only required when used with 1st generation
PCF2600x baseband controllers
- 5 x 5 mm HVQFN32 package
UAA3559 lowest power Bluetooth radio IC
- Low cost transceiver
- Fully integrated receiver and demodulator, no external filters required
- 4 dBm transmit pre-amplifier
- Fully integrated low phase noise VCO with on-chip inductors, operates
at twice the Bluetooth frequency (simplifies application: no external
inductances with associated problems of pulling and other coupling
effects)
- Low current consumption (lower than the UAA3558)
- Target 2.7 V minimum operating voltage, 3.4 V maximum operating voltage
(for compatibility with mobile phones and 2nd generation baseband ICs)
- Wide temperature range, target –30 to +85 °C (covers full mobile
phone temperature range)
- 5 x 5 mm HVQFN32
UAA3591 single-chip, Class 1 compliant power amplifier
- 24 dBm (250 mW) output power
- 45% typical power-added efficiency
- Suitable for 100% duty cycle
- Silicon process for optimum price/performance
- Analog power control pin
- 4 x 4 mm HVQFN16 package
PCF2600x 1st generation baseband controllers
- Embedded ARM7TDMI core
- Embedded Ericsson Bluetooth Core (EBC) operating as Link Controller
- On-chip execution of Ericsson Protocol Stack
- Point-to-point and point-to-multipoint versions
- On-chip voice coding
- USB, UART, IrDa, PCM and I2C-bus interfaces
- 8 x 8 mm FPBGA96/100 and TQFP100 package options
PCF87750 2nd generation general-purpose baseband controller (‘Blueberry’)
- Embedded ARM7TDMI RISC core, plus enhanced Ericsson Bluetooth Core
operating as Link Controller
- Bluetooth 1.1 compliant
- Embedded 384 kB Flash and 64 kB SRAM
- Clock crystals to 26 MHz
- Voice and data support
- Antenna diversity support
- Numerous interfaces including USB, SPI, UART, PCM/IOM, I2S, I2C-bus and
general-purpose I/Os
- Supports variety of RF interfaces
- 9 x 9 mm small footprint LFBGA81 package
PCF87751 2nd generation baseband optimized for voice applications
- Derivative of the PCF87750 GP baseband
- Bluetooth 1.1 compliant
- Dedicated for voice communications (headsets, digital cordless phones,
etc.)
- Numerous interfaces including UART, I2C-bus and general-purpose I/Os
- Supply voltage: 1.8V
- Embedded Flash in CMOS 0.18 µm process
- Enhanced power management for 1 battery cell (NiMH, Ni-Cad)
- On chip voice AD/DA CODEC
- Adapted for multichip package
- Supports variety of RF interfaces
- 6 x 6 mm very small footprint LFBGA64 package
PCF87752 2nd generation baseband optimized for data applications
- Derivative of the PCF87750 baseband
- Bluetooth 1.1 compliant
- Dedicated for data communications (mobile phones, PDAs, PC peripherals,
etc.)
- Voice link support through PCM/IOM interface
- Numerous interfaces including UART, I2C-bus and general-purpose I/Os
- Adapted for multichip package
- Embedded Flash in CMOS 0.18 µm process
- Supply voltage: 1.8 V
- Supports variety of RF interfaces
- 6 x 6 mm very small footprint LFBGA64 package
PCF87753 multichip package for data applications
- Consists of PCF87752 data baseband plus RF IC
- 5.5 x 13.5 mm LFBGA96 package
PCF87754 multichip package for voice applications
- Consists of PCF87751 voice baseband plus RF IC
- 5.5 x 13.5 mm LFBGA96 package
BByK second generation developer’s kit (full version)
- 2 motherboards with on board Flash and RAM memory
- 3 daughter boards:TB208,TB208E and TB81
- 2 RF boards
- Connectors for UART, USB, I2C-bus, SPI, IOM/PCM, CODEC, and JTAG
interfaces
- Lauterbach Trace32-FIRE and Hewlett-Packard Real-Time Trace emulator
interface
- Based on 2nd generation PCF87750 baseband controller
- Bluetooth RF link based on UAA3558 radio IC and BGB100 radio module
- Two wired headsets, AC/DC power supply adapters, cables, CD-ROM
- Embedded Bluetooth protocol stack software, V 1.1 compliant
Baby board full second generation demonstration kit
- 3 smallest form-factor Bluetooth demonstration boards, consisting of
PCF87750 baseband plus UAA3558 RF IC or BGB100 RF module
- UART connection
- Possibility to demonstrate Bluetooth capability including CDROM with
setup software and Tetris game
- Embedded Bluetooth protocol stack software, v 1.1 compliant
- Possibility to setup small piconet, point-to-point or
point-to-multi-point
- Size: 53 x 40 mm
Last updated: 27-Mar-2006
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